Item |
Details |
Material |
FR-4 (UV, Halogen Free, High Tg), CEM-3, CEM-1 |
No. of layer |
1-8 |
Laminate thickness |
0.4 to 3.2mm |
Maximum panel size |
18 x 24 sq.inch |
Min./Max.drill size |
0.3 – 6.5mm |
Aspect Ratio |
6:1 |
Hole tolerance/registration |
+/-0.10mm |
Pad diameter |
min. 0.30mm ＋ max. finished hole size |
Imaging |
Dry Film |
Line width/Line spacing min |
3 mil (0.075mm) – UL approved |
Minimum SMT pitch |
16 mil (0.40mm) |
Plating (Additive Method) |
Immersion Ag, Lead free HASL, OSP, ENIG, Electroplating Flash gold/Bondable gold, HASL |
Solder mask |
Liquid Photo Imageable (LPI) |
Option |
Polymer Thick Film (PTF), Blue peelable mask, Carbon Keypads, V-cut/Scoring, Push back |
Electrical Tests |
| Net list testing c'mos and dual access test fixture |
| Voltage |
100 - 300 VDC |
| Isolation |
1MΩ - 100 MΩ |
| Continuity |
5 - 100 Ω |
|
HASL Board
No clean process |
Below 6.4 ug NaCl/ sq. in. at room temperature |
Outgoing quality checking |
AQL major 0.65 minor 2.5 based on our workmanship standard EN/WS001 and IPC-600 or as per customers requirements |
Quality standard/system |
IPC-A-600, IPC-M-105, ISO/TS16949, ISO9001, ISO14001 |
Service |
Panelization Drawings
Gerber Editing
CAD work station, DRC,
Unit arrangement to panel form
(Scored format, Tab break away format)
Re-arrangement of panel size |
