Item

Details

Material

FR-4 (UV, Halogen Free, High Tg), CEM-3, CEM-1

No. of layer

1-2 (4-6: Pending)

Laminate thickness

0.4 to 3.2mm

Usual production panel size

18 x 24 sq.inch

Min./Max.drill size

0.3 - 6.5mm

Aspect Ratio

6:1

Hole tolerance/registration

+/-0.10mm

Pad diameter

min. 0.30mm + max. finished hole size

Imaging

Dry Film

Line width/Line spacing min

3 mil (0.075mm) - UL approved

Minimum SMT pitch

16 mil (0.40mm)

Plating (Additive Method)

Immersion Ag, Lead free HASL, OSP, ENIG, Electroplating Flash gold/Bondable gold, HASL

Solder mask

Liquid Photo Imageable (LPI)

Option

Polymer Thick Film (PTF), Blue peelable mask, Carbon Keypads, V-cut/Scoring, Push back

Electrical Tests

Net list testing c'mos and dual access test fixture
Voltage 100 - 300 VDC
Isolation 1 MΩ - 100 MΩ
Continuity 5 - 100 Ω

HASL Board
No clean process

Below 6.4 ug NaCl/ sq. in. at room temperature

Outgoing quality checking

Monitored by COA and external ppm, according to EN/WS001; IPC-A-600; customer requirements

Quality standard/system

IPC-A-600, IPC-M-105, ISO/TS16949, ISO9001, ISO14001, QC080000

Service

Panelization Drawings
Gerber Editing
CAD work station, DRC,
Unit arrangement to panel form
(Scored format, Tab break away format)
Re-arrangement of panel size

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RFQ
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